New Delhi: Prime Minister Narendra Modi on Wednesday participated in ‘India’s Techade: Chips for Viksit Bharat’ and laid the foundation stone of three semiconductor projects worth about Rs 1.25 lakh crore via video conferencing. The PM also addressed the youth across the country on the occasion.
After laying the foundation stone, Prime Minister Narendra Modi said, "Today is a historic day. Today, we are also scripting history & taking a strong step ahead towards a bright future."
"Leaders from Taiwan have also joined us in today's program virtually. I am very excited about the attempts made by India. More than 60 thousand colleges, universities & educational institutes are associated with today's event," Modi further said.
PM Modi asserted that when India commits, it delivers, referring to his government's commitment to make the country a semiconductor manufacturing hub. "When India commits, India delivers and democracy also delivers," Modi said.
The Centre said that it has been the vision of the PM to position India as a global hub for semiconductor design, manufacturing and technology development, fostering the creation of employment opportunities for the nation's youth.
Addressing the conference, Union Minister Ashwini Vaishnaw said, "Four semiconductor units are being built in the country...One of the four semiconductor units is coming up in Assam...The four plants are an example of work being done at a great pace under the double-engine government...The cabinet gave its approval on 29th February 2024 for TATA & CG power plants and within 15 days PM Modi will lay the foundation stone..."
In line with this vision, foundation stone has being laid for the Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR), Gujarat; Outsourced Semiconductor Assembly and Test (OSAT) facility at Morigaon, Assam; and the Outsourced Semiconductor Assembly and Test (OSAT) facility at Sanand, Gujarat.
The Semiconductor fabrication facility at the Dholera Special Investment Region (DSIR) will be set up by Tata Electronics Private Limited (TEPL) under the Modified Scheme for setting up of Semiconductor Fabs in India. With a total investment of over Rs. 91,000 crore, this will be the first commercial semiconductor fab in the country.
The Outsourced Semiconductor Assembly and Test (OSAT) facility in Morigaon, Assam will be set up by Tata Electronics Private Limited (TEPL) under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), and with total investment of about Rs 27,000 crore.
The Outsourced Semiconductor Assembly and Test (OSAT) facility in Sanand, will be set up by CG Power and Industrial Solutions Limited under the Modified Scheme for Semiconductor Assembly, Testing, Marking and Packaging (ATMP), and with total investment of about Rs 7,500 crore.
Through these facilities, the semiconductor ecosystem will be strengthened and will get a firm footing in India. These units will also provide employment to thousands of youth in the semiconductor industry as well as catalyse employment generation in related sectors like electronics, telecom etc.
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